The overall demand for tin solder remained stable, and tight supply supported the rise in tin prices [SMM Tin Morning Meeting Summary]

Recently, the overall demand in the solder market remained stable, but the internal demand structure showed differentiation. On one hand, traditional solder application fields such as electronics and electrical appliances saw steady growth in demand, providing some support for tin prices. On the other hand, the demand in the PV welding strip market remained sluggish and did not recover as expected, offering limited support for tin prices. This difference in demand structure led to a narrower fluctuation range for tin prices, with market forces tending to balance out. Although the effects of the national policies to stabilize growth gradually became apparent, it would take time for these policies to be transmitted to the real economy, thus constraining the growth momentum of tin solder production. Meanwhile, under the influence of fundamentals, tin prices showed a trend of fluctuating consolidation. From the perspective of market sentiment, last week's tin price trend failed to effectively stimulate the purchasing enthusiasm of market participants. Most enterprises remained on the sidelines, waiting for the market to become clearer. This cautious market sentiment somewhat suppressed the upward momentum of tin prices, making it difficult for tin prices to break through in the short term. SHFE tin prices are expected to fluctuate upward. The tight supply and steady demand growth will jointly push tin prices higher. However, it should also be noted that there are uncertainties in the market, such as macroeconomic fluctuations, policy adjustments, and changes in market sentiment, which may all cause short-term shocks to tin prices.